Bergquist's Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world's largest OEMs in various industries including automotive, computer, power supply, military and motor control.
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Sil-Pad Products Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Sil-Pad provides:
- Excellent thermal performance
- Eliminates the mess of grease
- More durable than mica
- Efficient "total applied cost" that compares favorably with other alternatives.
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Gap Pad Products Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Gap Pad provides:
- Elimination of air gaps to reduce thermal resistance
- High conformability to reduce interfacial resistance
- Low-stress vibration dampening
- Compatible with automated dispensing equipment
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Bond-Ply Products The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a PSA or laminating format. Bond-Ply provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. Bond-Ply provides:
- A replacement to heat cure adhesives
- A replacement to screw mounting
- A replacement to clip mounting
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Hi-Flow Products Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between CPU or power devices and a heat sink. Hi-Flow materials change from a solid at specific temperatures and flow to assure total wet-out of the interface without overflow. Hi-Flow provides:
- A replacement to grease, saving time and money without sacrificing thermal performance
- No mess- thixotropic characteristics keep it from flowing out of the interface
- Easier handling- not tacky at room temperature
- Simplified application process with many tabbed configurations
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Liquid Dispensed Materials
Gap Fillers
Bergquist Gap Filling materials deliver superior thermal conductivity and are the ideal solution for liquid dispensed applications. As form in-place elastomers, their ultra-conforming properties provide infinite thickness coverage for uneven board topography. They are ideal for fragile and low-stress applications such as power electronics and discrete devices. |
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Liquid Adhesive
Bergquist Liquid Adhesives allow mechanical attachment of the
component to the heat sink with thermal transfer properties without
the need for added fasteners. The Liqui-Bond product line also exhibits mild elastic properties to assist in relieving CTE mismatches.
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Thermal Interface Compounds
Bergquist's line of thermally conductive thermal interface compounds will flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance. TIC products are designed for use between a high-end computer processor and a heat sink or other high watt density applications. |
